The Thesis
Three forces behind the chipmaking buildout
The capex wave is arriving.
AI hyperscalers have committed roughly $720 billion of capital expenditure for 2026. That spending flows down the AI supply chain to the common suppliers every chipmaker needs for production: the wafer fabrication, advanced packaging and metrology companies CHIP holds.
Governments are funding fabs.
The CHIPS Act, EU Chips Act, Rapidus and India are funding new fabs that each need a full equipment build-out. This driver is set by national security logic, not AI sentiment.
Complexity compounds.
Every chip generation adds process steps rather than removing them. Taller memory stacks and bonded dies each add deposition, etch, bonding and measurement cycles to the same wafer.
2. Combined calendar-2026 capital expenditure guidance of Amazon, Alphabet, Meta Platforms and Microsoft, per company Q2 2026 earnings reports (July and August 2026). 3. SEMI, Mid-Year Total Semiconductor Equipment Forecast, OEM Perspective, July 14, 2026. 4. Semiconductor Industry Association. Forecasts are third-party estimates and are not guarantees of future results or of Fund performance.
From $135B to a projected $229.5B in three years.
One theme. One ticker. CHIP is built to hold the equipment makers positioned across that growth, not a broad basket of chip designers and foundries.
Global semiconductor equipment sales plotted to scale: 2025 actual billings of $135.1B, then SEMI’s forecasts of $165.9B (2026), $201.2B (2027) and $229.5B (2028). Source: SEMI, Worldwide Semiconductor Equipment Market Statistics (April 7, 2026) and Mid-Year Total Semiconductor Equipment Forecast, OEM Perspective (July 14, 2026). Forecasts are third-party estimates and are not guarantees of future results. Not a projection or indication of Fund performance.
The equipment layer of the AI buildout, in one trade.
Dedicated exposure to the companies that make the tools every AI chip has to pass through: wafer fabrication equipment, advanced packaging, and metrology. Not the chip designers and foundries that buy from them.
Wafer fabrication equipment: the machinery that builds the foundational silicon for every chip.
See the Holdings →Advanced packaging and metrology, weighted equally so no single segment drives the outcome.
Rules-Based Index
Tracks the VettaFi AI Chipmaking Index. Every constituent derives more than 50% of revenue from one of the three segments; holdings are capped at 5% and rebalanced quarterly.
Read the Prospectus →Global by Design
U.S.-listed companies account for 35.3% of the index by weight, so most of the index is not reachable through U.S.-listed shares. Tokyo Electron, Advantest and DISCO are Japanese; ASML and Besi are Dutch.
Fund Facts
Performance
CHIP Performance
The performance data quoted represents past performance. Past performance does not guarantee future results. The investment return and principal value of an investment will fluctuate so that an investor’s shares, when sold or redeemed, may be worth more or less than their original cost and current performance may be lower or higher than the performance quoted. Performance current to the most recent month-end can be obtained by calling 1-844-802-4004. Short term performance, in particular, is not a good indication of the fund’s future performance, and an investment should not be made based solely on returns.
Market Price: The current price at which shares are bought and sold. Market returns are based upon the last trade price.
NAV: The dollar value of a single share, based on the value of the underlying assets of the fund minus its liabilities, divided by the number of shares outstanding. Calculated at the end of each business day.
Holdings
CHIP Holdings
Under normal market conditions, the Fund will invest at least 80% of its net assets (plus any borrowings for investment purposes) in the securities that comprise the Index. The Fund will generally invest in all of the securities comprising the Index in approximate proportion to their weightings in the Index. Companies whose business operations derive more than 50% of their revenues from Wafer Fabrication Equipment, Advanced Packaging or Metrology (collectively, “Chipmaking Enabling Companies”) are included in the Index.
The Index utilizes a modified free float market capitalization weighted methodology for both Pureplay and Diversified companies. The Pureplay companies are weighted with a maximum weight of 15% per constituent. In the event Pureplay constituents are weighted greater than 5%, the constituents are reduced proportionately until the sum of the weights greater than 5% are less than approximately 45% of the Index. Then, the excess weights are redistributed to the remaining constituents. If there are 10 or more Pureplay companies, then the top three constituents will be capped at 15% and the remaining Pureplay companies will be equally weighted. If there are nine Pureplay companies, then the top two constituents will be capped at 22.5% and the remaining Pureplay companies will be equally weighted. If there are eight Pureplay companies, then the top two constituents will be capped at 25% and the remaining Pureplay companies will be equally weighted. If there are less than eight Pureplay companies, then all of the Pureplay companies will be free float market capitalization weighted with a constituent cap of 15% with no additional caps. The Diversified companies are weighted with a maximum weight of 5% per constituent.
The VettaFi AI Chipmaking Index is a rules-based index provided by VettaFi comprising global companies that derive more than 50% of their revenues from wafer fabrication equipment, advanced packaging or metrology. The Index allocates 50% to wafer fabrication equipment, 25% to advanced packaging and 25% to metrology at each quarterly rebalance, with a 5% cap per holding. One cannot invest directly in an index.
Fund holdings are subject to change.
Holdings
CHIP Holdings
Under normal market conditions, the Fund will invest at least 80% of its net assets (plus any borrowings for investment purposes) in the securities that comprise the Index. The Fund will generally invest in all of the securities comprising the Index in approximate proportion to their weightings in the Index. Companies whose business operations derive more than 50% of their revenues from Wafer Fabrication Equipment, Advanced Packaging or Metrology (collectively, “Chipmaking Enabling Companies”) are included in the Index.
The Index utilizes a modified free float market capitalization weighted methodology for both Pureplay and Diversified companies. The Pureplay companies are weighted with a maximum weight of 15% per constituent. In the event Pureplay constituents are weighted greater than 5%, the constituents are reduced proportionately until the sum of the weights greater than 5% are less than approximately 45% of the Index. Then, the excess weights are redistributed to the remaining constituents. If there are 10 or more Pureplay companies, then the top three constituents will be capped at 15% and the remaining Pureplay companies will be equally weighted. If there are nine Pureplay companies, then the top two constituents will be capped at 22.5% and the remaining Pureplay companies will be equally weighted. If there are eight Pureplay companies, then the top two constituents will be capped at 25% and the remaining Pureplay companies will be equally weighted. If there are less than eight Pureplay companies, then all of the Pureplay companies will be free float market capitalization weighted with a constituent cap of 15% with no additional caps. The Diversified companies are weighted with a maximum weight of 5% per constituent.
The VettaFi AI Chipmaking Index is a rules-based index provided by VettaFi comprising global companies that derive more than 50% of their revenues from wafer fabrication equipment, advanced packaging or metrology. The Index allocates 50% to wafer fabrication equipment, 25% to advanced packaging and 25% to metrology at each quarterly rebalance, with a 5% cap per holding. One cannot invest directly in an index.
Fund holdings are subject to change.
Median 30 Day Spread is a calculation of Fund’s median bid-ask spread, expressed as a percentage rounded to the nearest hundredth, computed by: identifying the Fund’s national best bid and national best offer as of the end of each 10 second interval during each trading day of the last 30 calendar days; dividing the difference between each such bid and offer by the midpoint of the national best bid and national best offer; and identifying the median of those values.
Documents
Regulatory Documents
The chipmaking equipment cycle, covered
View All Articles →Read the latest semiconductor equipment coverage on our News & Insights page.
